Rogers Displays Old And New At IMAPS

If circuit materials are the fundamental building blocks of electronics, then the interest should be high at the Rogers Corp. booth at the IMAPS Device Packaging show next week (March 10-11, 2009, Radisson Fort McDowell Resort and Casino, Scottsdale/Fountain Hills, AZ). Rogers plans on showing a mix of proven and new materials at the show, including its well-established RO4000 and ULTRALAM laminate materials for high-speed, high-frequency wireless and telecommunications applications.

In addition, Rogers will show its recently introduced RO2808 ceramic-filled PTFE circuit-board material with dielectric constant of 7.6 and high stability comparable to low-temperature-cofired-ceramic (LTCC) materials. With a loss tangent of 0.002 or less, the material can be supplied as 1-mil-thick boards for low-profile designs.

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