Packaging Technology Aids Thermal Management

March 19, 2009
Honeywell has developed a lead-free packaging technology that improves the thermal management of semiconductor chips. Called Honeywell Pb-free Die Attach Solder, the lead-free thermal interface material effectively manages heat produced by semiconductor ...
Honeywell has developed a lead-free packaging technology that improves the thermal management of semiconductor chips. Called Honeywell Pb-free Die Attach Solder, the lead-free thermal interface material effectively manages heat produced by semiconductor chips to improve chip reliability. The new lead-free solder alloys are designed to meet demanding mechanical and thermal requirements, particularly resistance to melting during board level solder reflow. Scott Miller, Metals Product Line Manager for Honeywell Electronic Materials, offers that "Honeywell has been developing lead-free die attach solder alloys for many years to meet the industry's green' requirements that emerged with the use of lead-free solder at the circuit board level. Our newest alloys will replace the high-lead alloys and provide better thermal management than other proposed lead-free thermal management alternatives such as polymer-based materials."

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