Packaging Protects IC Performance

Integrated circuits (ICs) provide tremendous functionality in small sizes. But they are susceptible to damage and short operating lifetimes unless properly packaged, and that is the main message of a Special Report in the February issue of Microwaves & ...
March 9, 2011

Integrated circuits (ICs) provide tremendous functionality in small sizes. But they are susceptible to damage and short operating lifetimes unless properly packaged, and that is the main message of a Special Report in the February issue of Microwaves & RF, "Perusing Package Options for ICs."

The article not only lists some of the major suppliers of high-frequency IC package houses, but also how some leading microwave IC designers have incorporated packages into their designs. The report also tracks some of the trends in combining multiple functions and ICs in the form of system-in-package (SiP) and multichip-module (MCM) devices.

About the Author

Jack Browne

Technical Contributor

Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.

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