Laminates Handle Hostile Environments

High-performance XT/duroid thermoplastic laminate materials from Rogers are ideal for high-frequency multilayer circuits for use in demanding environments. The new halogen-free materials include XT/duroid 8000 laminates for designs with as many as five layers and XT/duroid 8100 laminates for six or more circuit layers. The XT/duroid 8000 laminates feature a z-axis dielectric constant of 3.23 0.05 at 10 GHz and a dissipation factor of 0.0035 or less at 10 GHz. They have a low thermal coefficient of dielectric constant of +7 ppm/C from -50 to +150C and exhibit excellent thermal conductivity of 0.35 W/m/K. Both laminate materials are available with dielectric thickness of 0.002 in. (0.0508 mm) with 0.5-oz. low-profile electrodeposited copper foil cladding. XT/duroid 8100 is also available with dielectric thickness of 0.004 in. (0.1016 mm).