Don't Forget The 2010 IEDM

Sept. 9, 2010
Autumn brings with it an end to summer, but also a slew of trade shows and conferences that tradionally carry significant content for RF and microwave engineers. Just a glance at the "Meetings" section below reviews some of the shows. For example, later ...

Autumn brings with it an end to summer, but also a slew of trade shows and conferences that tradionally carry significant content for RF and microwave engineers. Just a glance at the "Meetings" section below reviews some of the shows. For example, later this month, and previewed in the September issue of Microwaves & RF, European Microwave Week kicks off in the La Defense section of Paris (at CNIT). This has become a "week" because it is actually an exhibition and four conferences together, including the European Microwave Conference, a radar conference, a microwave-integrated-circuit (MIC) conference, and a wireless conference. Early next month, those working with defense customers will surely want to visit Atlanta for this year's annual Association of Old Crows (AOC) conference and exhibition.

As vital as these and other events are this fall, it is difficult to underestimate the importance of the International Electron Devices Meeting (IEDM) scheduled for December 6-8, 2010 at the San Francisco Hilton in Union Square. This long-running IEEE event is one of the few showcases for both vacuum-tube devices and semiconductor devices. In fact, it is a showcase for perhaps the widest range of device technologies found in any technical/engineering conference, covering such topics as compound semiconductor devices, microelectromechanical-systems (MEMS) devices, optoelectronics, nanotechnology, and display devices. These technologies touch all application areas, from commercial and industrial to medical and military, showing solutions for even the latest applications, such as energy harvesting and fourth-generation (4G) wireless communications. When it comes time to check on the state of device technology, don't forget the 2010 IEDM.

About the Author

Jack Browne | Technical Contributor

Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.

Sponsored Recommendations

Wideband MMIC LNA with Bypass

June 6, 2024
Mini-Circuits’ TSY-83LN+ wideband, MMIC LNA incorporates a bypass mode feature to extend system dynamic range. This model operates from 0.4 to 8 GHz and achieves an industry leading...

Expanded Thin-Film Filter Selection

June 6, 2024
Mini-Circuits has expanded our line of thin-film filter topologies to address a wider variety of applications and requirements. Low pass and band pass architectures are available...

Mini-Circuits CEO Jin Bains Presents: The RF Engine of the 21st Century

June 6, 2024
In case you missed Jin Bains' inspiring keynote talk at the inaugural IEEE MTT-S World Microwave Congress last week, be sure to check out the session recording, now available ...

Selecting VCOs for Clock Timing Circuits A System Perspective

May 9, 2024
Clock Timing, Phase Noise and Bit Error Rate (BER) Timing is critical in digital systems, especially in electronic systems that feature high-speed data converters and high-resolution...