Software-Based Seminar Aids RFIC Designers

March 4, 2004
Sponsored by Agilent Technologies (Palo Alto, CA), in collaboration with Cadence Design Systems (San Jose, CA) and austriamicrosystems, the 2004 Advanced RFIC Design Seminar offers an opportunity for working design engineers to understand how to ...

Sponsored by Agilent Technologies (Palo Alto, CA), in collaboration with Cadence Design Systems (San Jose, CA) and austriamicrosystems, the 2004 Advanced RFIC Design Seminar offers an opportunity for working design engineers to understand how to transform system specifications into final products. The seminar demonstrates in detail how Agilent's RF Design Environment (RFDE) software system helps RFIC development reduce risk, cut costs, and shorten time to market. Sponsored by Microwaves & RF and Wireless Systems Design magazines, The 2004 Advanced RFIC Design Seminar has been created for RFID design engineers and engineering managers as well as for computer-aided-design (CAD) support engineers and managers. The one-day seminar provides techniques for verifying the behavior of RF circuit designs at the system level before proceeding to manufacturing, for improving the design on on-chip passive components, such as spiral inductors, and for performing frequency-domain simulations within Cadence's Virtuoso design platform.

A variety of high-quality presentations have been lined up for the 2004 Advanced RFIC Design Seminar, including "OFDM Transceiver Design and Verification: An Integrated Methodology for System and Circuit Simulations" (in two parts) and "Accurate Modeling of Spiral Inductors on Silicon using Advanced EM Simulation," both presented by Agilent Technologies, "A 1.7-GHz VCO implemented in austriamicrosystems' 0.35-micron HBT BiCMOS Process" presented by austriamicrosystems, and "Leveraging the Speed of the Top-Down Design Methodology Combined with the Silicon Accuracy of Bottom-Up Design Capabilities" presented by Cadence Design Systems.

The 2004 Advanced RFIC Design Seminar is free of charge for high-frequency engineers and engineering managers and CAD support engineers and managers. It is scheduled for the following dates and locations: Monday, April 12th, Santa Clara, CA Tuesday, April 13th, Santa Clara, CA Wednesday, April 14th, Los Angeles, CA Thursday, April 15th, San Diego, CA Friday, April 16th, Phoeniz, AZ Tuesday, April 20th, Minneapolis, MN Wednesday, April 21st, Chicago, IL Thursday, April 22nd, Richardson, TX Friday, April 23rd, Austin, TX Monday, April 26th, Allentown, PA Tuesday, April 27th, Somerset, NJ Wednesday, April 28th, Ottawa, Ontario, Canada Thursday, April 29th, Andover, MA Friday, April 30th, Greensboro, NC

About the Author

Jack Browne | Technical Contributor

Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.

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