Custom RF/DC Packages Serve Military Markets

Oct. 29, 2009

A line of custom hermetic surface-mount-technology (SMT) packages from Remtec is ideal for high-reliability applications in aerospace, military, and industrial markets. The fully hermetic, low-profile packages can withstand power levels to 100 W and current to 75 A. They can handle frequencies to 10 GHz and beyond. Packages are available for multichip modules (MCM), with ball grid array (BGA) construction, and with SMT leadless and leaded input/output connections and high-voltage insulation. The SMT packages serve as a viable alternative to co-fired ceramic packages as well as metal-based glass-to-metal hermetic enclosures.

About the Author

Jack Browne

Technical Contributor

Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.