Wireless Distribution System Eliminates Dispersion In Clock Networks

Nov. 12, 2007
AS SYSTEM OPERATING frequency and projected die size increase, it has become more difficult to distribute clock signals across a chip. The resulting problems include larger R-C delays, tighter skew and jitter tolerance, and signal dispersion ...

AS SYSTEM OPERATING frequency and projected die size increase, it has become more difficult to distribute clock signals across a chip. The resulting problems include larger R-C delays, tighter skew and jitter tolerance, and signal dispersion along metal interconnect paths. To reduce skew and the impact of dispersion, a compact, wireless clock distribution system with an external planar antenna has been proposed by Maxim´s Ran Li, Silicon Laboratories´ Xiaoling Guo, RF MicroDevices´ Dong-Jun Yang, and Kenneth K. O from the University of Florida.

This system has been shown to provide phase and amplitude distributions suitable for synchronizing circuits over a 35-mm diameter circular area at 3 GHz. The system comprises a transmitter and an off-chip antenna and multiple clock receivers with on-chip antennas distributed over an integrated circuit (IC) or multiple ICs. The transmitter, which was fabricated in a 130-nm CMOS process, generates a 17-GHz clock signal. See "Wireless Clock Distribution System Using an External Antenna," IEEE Journal of Solid-State Circuits, Oct. 2007, p. 2283.

About the Author

Nancy Friedrich | RF Product Marketing Manager for Aerospace Defense, Keysight Technologies

Nancy Friedrich is RF Product Marketing Manager for Aerospace Defense at Keysight Technologies. Nancy Friedrich started a career in engineering media about two decades ago with a stint editing copy and writing news for Electronic Design. A few years later, she began writing full time as technology editor at Wireless Systems Design. In 2005, Nancy was named editor-in-chief of Microwaves & RF, a position she held (along with other positions as group content head) until 2018. Nancy then moved to a position at UBM, where she was editor-in-chief of Design News and content director for tradeshows including DesignCon, ESC, and the Smart Manufacturing shows.

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