Based on the method of moments (MoM), the 3D planar EM software also includes expanded support for multicore microprocessor configurations to further reduce simulation time. In addition, improvements to loss models deliver more robust data at low frequencies. Extensive sources/ports and de-embedding options that provide greater flexibility and accuracy when handling internal edges, extracting ports, and modeling coupled lines. The AXIEM software can be used as a stand-alone tool or as part of the Microwave Office design environments. It is ideal for the EM analysis of planar components such as RF printed circuit boards (PCBs) and modules, low-temperature, co-fired ceramic (LTCC) packages, monolithic microwave integrated circuits (MMICs), and RF integrated circuits (RFICs).
About the Author
Jack Browne
Technical Contributor
Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.