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Ceramic Specialist Celebrates 20 Years

April 1, 2010

Ceramic substrate and package supplier Remtec recently marked 20 years in the industry, serving both commercial and military customers. The firm, known for its plated copper on thick film (PCTF) packaging technology, was founded in 1990 and issued a patent for its PCTF technology in 1994. According to Remtec President Nahum Rapoport, "Over these years, we have focused on design, development and manufacture of reliable, cost-effective products providing a multitude of ceramic packaging solutions that meet the changing and demanding needs in DC power electronics, RF/microwave packaging and optoelectronics."

About the Author

Jack Browne | Technical Contributor

Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.