PCB Tools and Technology

SDR requires a complex web of circuity on PCBs that not only defines the device's functionality, but also the performance of these microwave and RF systems. Various factors come...

Available on the Altium 365 cloud platform and connected directly to MacroFab’s fully digital, elastic manufacturing platform, Altimade enables customers to request an instant...

What are the board-design considerations for building circuits targeting mmWave apps? This article highlights the main design issues and offers some tips and tricks to help you...

Today’s high-data-rate, high-frequency designs create new challenges for printed-circuit-board design.

Software enables secure collaboration between PCB designers and manufacturers; initial release includes instant DFM analysis.

Soldering can make or break a PCB, both figuratively and literally. This article offers basic tips and nine specific problems/mistakes to look out for when doing a soldering job...

Sorting through the specifications helps when selecting a circuit material for microwave, millimeter-wave, and even high-speed-digital circuits.

Sorting through different RF/microwave circuit materials educed comparisons of performance improvements and cost hikes, although some materials may save processing expenses.

Requirements are somewhat different for circuit materials supporting RF/microwave power amplifiers compared to materials for low-noise amplifiers.

Circuit materials are available in a wide range of formulations that represent tradeoffs in price, performance, and fabrication difficulty for RF and microwave circuits.

Thermal management in high-frequency circuits depends on careful choice of circuit and packaging materials to remove heat and preserve high performance levels.

Understanding different characterization parameters related to temperature can help when selecting a printed-circuit-board material for high-power RF/microwave applications.