Simulating & Optimizing RF Circuits in 3DHI Advanced Packaging

Learn the significance of co-simulation and co-optimization across multiple domains, including ICs, interconnects, and antennas, to achieve optimal RF performance in advanced packaging.
Oct. 5, 2026

To successfully complete a 6G RF design or even an advanced 5G project, you’ll need to employ 3D heterogeneous integration (3DHI). However, traditional RF electronic design automation (EDA) tools have been siloed, requiring extensive manual effort to transfer design information between them. This can introduce time-consuming errors in the 3DHI design process. Fortunately, new AI-driven RF design tools are coming online that simplify RF circuit simulation, RF circuit co-optimization, and other design tasks.

This e-book, Simulating & Optimizing RF Circuits in 3DHI Advanced Packaging, explains how teams can leverage these new tools and techniques. In the e-book, readers will discover:

• The importance of co-simulation and co-optimization of silicon ICs, III-V ICs, MMICs, interconnects, packages, boards, and antennas;

• How natural-language prompts can initiate a successful AI-driven RF design; and

• How to achieve traceable control over multi-domain simulation and optimization to facilitate extensive design explorations by multiple team members.

Download this e-book today to learn how AI-driven RF design tools can help you meet multi-specification performance goals through comprehensive multi-domain co-simulation and co-optimization.