During the 2015 International Microwave Symposium (IMS) IMS Exhibition, scheduled for May 19-21, representatives from Rogers Corp. will be on hand at Booth No. 3640. They will be providing details about the firm’s printed-circuit-board (PCB) materials—specifically, its RO4835 and RO4360G2 high-frequency laminates, along with its COOLSPAN TECA thermally and electrically conductive adhesive films.
The RO4835 laminates are intended for circuit applications requiring performance stability with time and temperature. These RoHS-compliant materials were developed with improved oxidation resistance but can be processed with standard FR-4 material methods for reduced production costs. RO4835 laminates exhibit a dielectric constant (Dk) of 3.48 at 10 GHz with a low-loss tangent of 0.0037 at 10 GHz. The low z-axis coefficient of thermal expansion (CTE) provides high plated-through-hole (PTH) reliability under a variety of processing and operating conditions.
In contrast, the RO4360G2 laminates offer a higher Dk of 6.15 at 10 GHz and can also be processed with FR-4 methods for reduced production costs. The higher Dk value allows designers to develop circuits with smaller dimensions for a given operating frequency, facilitating tighter packaging.
COOLSPAN TECA is a thermally and electrically conductive adhesive film intended to solve many circuit thermal management issues. It offers a straightforward means of attaching circuits to heat-bearing structures, such as heatsinks.
Rogers also will have a presence at the IMS technical sessions. Technical Marketing Manager John Coonrod, author of the company’s ROG blog series, will make two MicroApps presentations—short-but-concise applications-based sessions that provide practical solutions in specific technical areas. The first of these, “Microwave PCB Structure Selection: Microstrip vs. Grounded Coplanar Waveguide,” is scheduled for Tuesday, May 19. The second, “PCB Fabrication Influences on Microwave Performance,” will take place Wednesday, May 20.
In addition, Coonrod will be running a workshop session Friday, May 22 titled “An Overview of Various Critical Thermal Management Issues for Microwave PCBs.” This is part of a larger workshop session schedule for that morning (8 a.m.-12 p.m.) on thermal management, “Thermal Management of High-Density Electronic Assemblies.”