Rogers Airs Laminates, Thermal Materials At DesignCon 2009

The Advanced Circuit Materials Division (ACMD) and its newly formed Thermal Management Solutions (TMS) Division of Rogers Corp. will be exhibiting RO4000, RO2808, and ULTRALAM 3000 high-frequency laminates and HEATWAVE and COOLSPAN thermal management materials at the upcoming DesignCon 2009 show, scheduled for Feb. 3-4, 2009 at the Santa Clara Convention Center (Santa Clara, CA). The laminates are well suited for high-performance analog and data-transmission application in computer, telecommunications, and wireless communications applications while the thermal management solutions are ideal for controlling heat in semiconductor packaging and power amplifiers.