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Rogers To Aid Circuit And Thermal Designers At IMS

Materials supplier Rogers Corporation plans to exhibit at the 2010 IEEE International Microwave Symposium with both printed-circuit-board (PCB) and thermal-management solutions. Rogers Advanced Circuit Materials (ACM) Division will show RT/duroid 5880LZ, RT/duroid 6202PR, and RO4360 laminate materials while the company's Thermal Management Solutions (TMS) Division will show its HEATWAVE metal matrix composites. The trade show (, the RF/microwave industry's largest event, is scheduled for May 25-27, 2010 at the Anaheim Convention Center, Anaheim, CA.

RT/duroid 5880LZ is a PTFE-based composite with unique filler for applications requiring low-density, light-weight circuit boards. RT/duroid 6202PR laminates offer outstanding dimensional stability of 0.05 to 0.07 mils/in. for stable planar resistors, resonators, filters, and other high-frequency circuits. RO4000 glass-reinforced thermoset materials can be processed in automated assembly lines just like FR-4. The product line includes RO4360 with dielectric constant of 6.15 at 2.5 and 10 GHz for miniature printed antennas.

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