EM Software Models Bond Wires

The 2012 IMS features a wide range of in-booth simulation software demonstrations, including AWR's at booth No. 1514. In addition to sponsoring its traditional Customer Appreciation Party at IMSnot to mention a host of MicroApps presentations (on the exhibition floor, at booth No. 1223), the firm is showing its new three-dimensional (3D) finite-element-method (FEM) electromagnetic (EM) simulation software, Analyst 2012. This software has been developed to help analyze bond wires, tapered viaholes, and other circuit features. In addition, the company will show its popular suite of simulation tools in Microwave Office™, its system-level simulator, Virtual System Simulator™, and a number of other software tools.

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