Metrology System Studies MCMs

The ContourSP large-panel metrology system developed by Bruker Corp. provides a large boost in evaluating multichip modules (MCMs) and other 3D printed-circuit-board (PCB) structures. Ideal for checking substrates with high-density interconnects (HDIs), these metrology systems can be used to measure each layer of a multiple-panel PCB panel during manufacturing, to contribute to increased yield and lower manufacturing costs. In an era of increasingly smaller PCB linewidths and tighter tolerances, the metrology systems are helping to dramatically improve productivity.