Materials Solutions Form Multilayer Circuits

Substrate materials are the foundations for RF/microwave circuits. Long-time supplier Rogers Corp. will be on hand at the 2012 IMS (booth No. 2902) with several high-performance materials, including their new 2929 bondply. The 2929 material is a thin-film adhesive for high-performance, high-reliability, multilayer circuits. It features a low dielectric constant of 2.9, matching the laminate layers it is bonding, and low loss tangent of less than 0.003. It is well suited for bonding the company's various high-performance laminate materials, including Rogers' RT/duroid® 6000, RO4000® and RO3000® series laminates.

Rogers will also have on display its new RO4835® high-frequency laminate, formulated with improved oxidation resistance. Ideal for applications requiring high electrical stability over time and temperature, RO4835 laminates exhibit a dielectric constant of 3.48 at 10 GHz and low loss tangent of 0.0037 at 10 GHz. They are RoHS-compliant, do not require special preparation, and can be processed using standard methods.

Rogers will also treat 2012 IMS exhibit visitors to two MicroApps presentations. The first is scheduled at 11:05 a.m. Tuesday, June 19 by John Coonrod, Rogers' Market Development Engineer ("Bonding Materials Used in Multi-layer Microwave PCB Applications"). The second, scheduled for 3:05 p.m. Wednesday, June 20, is by Rogers' Associate Research Fellow, Allen Horn III ("Reducing Active Device Temperature Rise and RF Heating Effects with High Thermal Conductivity, Low Loss Circuit Materials").

Hide comments

Comments

  • Allowed HTML tags: <em> <strong> <blockquote> <br> <p>

Plain text

  • No HTML tags allowed.
  • Web page addresses and e-mail addresses turn into links automatically.
  • Lines and paragraphs break automatically.
Publish