People

Jan. 16, 2007
Azimuth Systems, Inc. has named JIM IULIANO as the company's new CEO. Iuliano has been CEO for both public and private technology companies for more than a decade. Previously, Iuliano was CEO of E Ink Corp. See Associated Figure Xceive Corp.—RICH ...

Azimuth Systems, Inc. has named JIM IULIANO as the company's new CEO. Iuliano has been CEO for both public and private technology companies for more than a decade. Previously, Iuliano was CEO of E Ink Corp.

See Associated Figure

Xceive Corp.—RICH BEYER to the board of directors; continues as CEO and director of Intersil Corp.

Tundra Semiconductor Corp.—TERRY NICKERSON to the board of directors; formerly CFO at ATI Technologies. Quantam3D, Inc.—STEPHEN GERSUK to vice president of technical marketing for the Quantam3D Visual and Sensor Simulation and Training team; formerly served in executive-level business-development positions at Aechelon Technology, Multigen-Paradigm, Contraves-SSI, Appli-mation, Inc., Signetics, and General Dynamics.

Kulicke & Soffa Industries, Inc.—RICHARD BOULANGER to general manager of the Die Bonder operations in Berg, Switzerland; formerly vice president of the Advanced Semiconductor Assembly Division of Universal Instruments Corp.

Plextek Ltd.—TIM PHIPPS to sales and marketing director; formerly responsible for European sales at TTPCom.

Herley Industries, Inc.—VERNON M. MOORE to chief scientist for the company; formerly principal systems engineer at Herley Lancaster.

Comarco, Inc.—MARK CHAPMAN to vice president and general manager of the Wireless Test Solutions Division; formerly a principal at The Bridgeworks Group, a position that included serving as vice president of business development at WiSpry.

iSuppli Corp.—LLOYD KAPLAN to COO; formerly executive vice president. Also, GREG SHEPPARD to chief development officer (CDO); formerly executive vice president. In addition, RAYMOND HAN to sales director of China; formerly general manager of CCID Consulting Co. Ltd.'s Semiconductor Division. And, SIMON WANG to industry analyst; formerly a procurement engineer at ZTE Corp.

Harris Corp.—JIM BURKE to vice president of corporate communications; formerly vice president of communications for AuthenTec.

Newark InOne—DEWIGHT WALLACE to president; continues until March 1 as general manager of MCM Electronics. Also, PAUL TALLENTIRE to president of Farnell InOne; formerly president of Newark InOne.

QUALCOMM, Inc.—DR. SANJAY K. JHA to COO; formerly executive vice president. Also, LEN J. LAUER to corporate executive vice president and group president overseeing key divisions; formerly COO for Sprint Nextel.

Raytheon Co.—JAY B. STEPHENS to secretary of the company; continues as senior vice president and general counsel of Raytheon.

Archetype Corp.—ALVA WRIGHT to director of West Coast sales; formerly executive account manager for Quake Global, Inc.

See Associated Figure

Southwest Research Institute (SwRI)—LE MOEY WIEBUSH, JR. to assistant director of the Surveillance and Geolocation Department in the Signal Exploitation and Geolocation Division; formerly manager of the Surveillance Systems Section.

See Associated Figure

Sponsored Recommendations

UHF to mmWave Cavity Filter Solutions

April 12, 2024
Cavity filters achieve much higher Q, steeper rejection skirts, and higher power handling than other filter technologies, such as ceramic resonator filters, and are utilized where...

Wideband MMIC Variable Gain Amplifier

April 12, 2024
The PVGA-273+ low noise, variable gain MMIC amplifier features an NF of 2.6 dB, 13.9 dB gain, +15 dBm P1dB, and +29 dBm OIP3. This VGA affords a gain control range of 30 dB with...

Fast-Switching GaAs Switches Are a High-Performance, Low-Cost Alternative to SOI

April 12, 2024
While many MMIC switch designs have gravitated toward Silicon-on-Insulator (SOI) technology due to its ability to achieve fast switching, high power handling and wide bandwidths...

Request a free Micro 3D Printed sample part

April 11, 2024
The best way to understand the part quality we can achieve is by seeing it first-hand. Request a free 3D printed high-precision sample part.