Intel Paves Its Broadband Wireless Road

Aug. 6, 2004
Intel recently made available its corporate thoughts on the company's place in emerging broadband wireless markets, in a white paper entitled "Broadband Wireless: The New Era in Communications." The eight-page white paper, which is available for ...

Intel recently made available its corporate thoughts on the company's place in emerging broadband wireless markets, in a white paper entitled "Broadband Wireless: The New Era in Communications." The eight-page white paper, which is available for free download from the company's web site (see below), defines broadband wireless as a "continuum of co-existing, overlapping technologies that enable wireless high-speed communications," with much credit give to the increased use of the Internet as responsible for the growth of wireless applications. The report notes that such technologies as third-generation cellular (3G), Wi-Fi, WiMAX, and ultrabroadband (UWB) techniques are all needed to form the global wireless infrastructure for high-speed communications and Internet access.

According to Sean Maloney, Executive Vice President and General Manager of Intel's Communications Group, "it's not a case of one technology becoming universal, or one technology replacing another. All of the wireless networks will be built out for different usages, with some overlap at the edges. But most importantly, the technologies will co-exist, creating more robust solutions that will enable a lot of new and exciting possibilities."

The publication includes a tabular summary of the aforementioned wireless technologies, supported by example scenarios of how broadband wireless capability will be achieved through the interconnection of the technologies. A short section details the Intel Communications Alliance (ICA) and how more than 150 companies have already aligned with Intel to develop technologies, components, and products that will provide the infrastructure for global, wireless, high-speed communications. The white paper includes addresses for a number of supporting web sites for broadband wireless designers (see link below).

Intel --> http://lists.planetee.com/cgi-bin3/DM/y/eA0JtlqC0Gth0BKHd0AY

Sponsored Recommendations

UHF to mmWave Cavity Filter Solutions

April 12, 2024
Cavity filters achieve much higher Q, steeper rejection skirts, and higher power handling than other filter technologies, such as ceramic resonator filters, and are utilized where...

Wideband MMIC Variable Gain Amplifier

April 12, 2024
The PVGA-273+ low noise, variable gain MMIC amplifier features an NF of 2.6 dB, 13.9 dB gain, +15 dBm P1dB, and +29 dBm OIP3. This VGA affords a gain control range of 30 dB with...

Fast-Switching GaAs Switches Are a High-Performance, Low-Cost Alternative to SOI

April 12, 2024
While many MMIC switch designs have gravitated toward Silicon-on-Insulator (SOI) technology due to its ability to achieve fast switching, high power handling and wide bandwidths...

Request a free Micro 3D Printed sample part

April 11, 2024
The best way to understand the part quality we can achieve is by seeing it first-hand. Request a free 3D printed high-precision sample part.