Computer security

Advanced SiP Technology Secures Embedded Processors

An advanced package design provides security and thermal protection for military microprocessors, memory, and other signal-processing components.

Security and size are two key factors in defense-based embedded computing systems, and a new system-in-package (SiP) technology from Mercury Systems, Inc. provides an innovative means of housing embedded computing devices in compact but extremely rugged packaging. The BuiltSECURE SiP microelectronics packaging technology (see figure) is designed for defense embedded computing applications with tight size, weight, and power (SWaP) requirements. It combines the company’s expertise in systems security engineering and 3D microelectronics packaging for demanding mission-management systems as well as command, control, and intelligence applications.

“Our BuiltSECURE SiP solutions are capable of providing the same security of long-lead application-specific integrated circuits (ASICs) at a fraction of the typical cost and schedule,” said Scott Orton, vice president and general manager of Mercury’s Trusted Mission Solutions group. “This is exactly what our customers are asking for in secure processing solutions.” The BuiltSECURE SiP technology provides this innovation in secure package by means of a single, extremely rugged, ball-grid-array (BGA) package.

“The pace of evolution in the modern threat environment demands a paradigm shift in microelectronics design and packaging technologies,” added Charlie Leader, senior vice president and general manager of Mercury’s Advanced Microelectronic Solutions group “We are honored to support our warfighters around the globe with agile, best-of-breed microelectronics technology powered by our next-generation business model.”

The package can be quickly customized for specific microprocessor packaging requirements, as well as for other critical embedded computing and signal-processing components—including memory modules and field-programmable gate arrays (FPGAs). The advanced package design features superior thermal-management capabilities, and can handle more than 100 W power per device. Device security is embedded by means of integrated secure boot capability and optional personalized security solutions.

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