Substrates Support Power Packages

A new line of direct bond substrates based on Curamik DBC direct-bond-ceramic (DBC) materials from Remtec, Inc. supports a wide range of power applications. By combining the DBC and plated copper on thick film (PCTF) technologies, circuit and package designers have a proven material for highly reliable designs. Available in a range of copper thicknesses from 0.0005 to 0.012 in. copper thickness, the substrates are supplied in nominal copper thicknesses of 0.005, 0.008, and 0.012 in. on 5.0 x 7.0 alumina and aluminum nitride cards.

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