Materials Make Mark At Electronics Midwest

A printed-circuit-board (PCB) materials system offered by Rogers Corporation should solve some multilayer design problems for high-frequency design engineers at the upcoming Electronics Midwest 2010 exhibition (Donald E. Stephens Convention Center, Rosemont, IL, Sept. 28-30, 2010). The firm's new 6.15 dielectric constant RO4360 laminate and 6.15 dielectric constant RO4460 prepreg system allows designers to create circuits with dimensions that are as much as 30 percent smaller than materials with lower dielectric constants, such as PTFE. The RO4360 laminate features a low dielectric loss of 0.003 at 2.5 GHz, a high thermal conductivity of 0.8 W/m-k, and is compatible with hybrid designs formed of different types of PCB materials.

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