HILLSBORO, ORTriQuint Semiconductor, Inc. an RF frontend product manufacturer and foundry services provider, received the "Northwest 100" award for 2008. The Seattle Times award recognizes the top 100 publicly held companies in the Pacific Northwest by measuring four dimensions of performance over the previous two fiscal years. According to the Seattle Times, to come out on top, a company has to do well on all four factors.
DURHAM, NCNextreme Thermal Solutions continues to receive industry accolades for its technology innovation excellence. TheThermal Copper Pillar Bump, Nextreme's core technology, and the OptoCooler module received awards from two leading technology magazines.
Advanced Packaging recognized the thermal bump with a 2008 Advanced Packaging Award in the thermal management technology category. The AP awards recognize excellence in industry innovation in the integrated circuit packaging engineering community.
Also, Nextreme's OptoCooler was given an award by Nanotech Briefs in their fourth annual Nano 50 Awards program, which recognizes the top 50 technologies, products, and innovators that have significantly impactedor are expected to impact the state of the art in nanotechnology. The winners of the Nano 50 awards are the "best of the bestthe innovative designs that will move nanotechnology to mainstream markets.
SAN FRANCISCO, CA AND CAMBRIDGE, UKCSR gave the world's first public demonstration of Bluetooth low energy technology provided by CSR's BlueCore7 in a mobile phone handset. The demonstration took place at the San Francisco meeting of the Bluetooth SIG Medical Working Group and consisted of a set of weighing scales and a temperature sensor connected via Bluetooth low energy to a cell-phone. This is a major step toward establishing a standard low-power wireless technology. The Bluetooth SIG expects final adoption of Bluetooth low energy technology in Q1, 2009.
SAN DIEGO, CAPeregrine Semiconductor Corporation, a supplier of high-performance RF CMOS and mixed-signal communications ICs, has shipped its 300 millionth UltraCMOS RFIC. The milestone was reached with an order for Peregrine's PE42672 SP7T RF switches that are designed into RF transmit and front-end modules for cellular handsets support-ing the WCDMA, HSPA, EDGE and GSM/GPRS networks, currently the fastest growing segment of the wireless market.
Historically, pin-diodes and GaAs-based devices held a dominant market position in the RF front end. However, as the demand for complex functionality in the front-end increased, designers sought a path toward integration of digital functionality.