Packaging has always been the "Achilles Heal" of extracting the maximum microwave performance out of any IC technology. The inherent parasitic capacitance and inductance associated with bond wires, lead frames, and encapsulating dielectric materials dominate the final products high frequency performance. One way to solve this problem is to eliminate parasitic causing factors and make the IC become the package. This is the basis of WSP (Wafer Scale Packaging).
Fill out the brief form below to download the whitepaper.