Mercury’s Memory Devices  Bound for Airborne System

Mercury’s Memory Devices Bound for Airborne System

Mercury Systems received a $3.2 million follow-on order from a leading defense contractor for solid-state memory devices for an airborne application.

Mercury Systems has received a $3.2 million follow-on order from a leading defense contractor for its BuiltSECURE ruggedized memory devices, which are being integrated into an advanced airborne military computing system. As with the follow-on business for multichip modules from a leading defense contractor (seeMercury Systems Supplies RF Modules for EW System” on mwrf.com), this order was booked in the company’s fiscal 2018 second quarter and is expected to ship over the next several quarters.

This secure solid-state device (SSD) is an example of the type of high-speed memory component that will be integrated into an advanced airborne military computing system. (Courtesy of Mercury Systems)

“Receiving this BuiltSECURE memory order from a prominent defense prime contract reaffirms Memory’s leadership role in the design and manufacturing of commercial microelectronics in a highly secure and trusted environment,” says Iain Mackie, vice president and general manager of Mercury’s Microelectronics Secure Solutions group. “We are honored to provide long-term supply continuity of high-speed, SWaP-optimized memory devices enabling the success of our military forces in the harshest operating environments,” adds Mackie. The hardware is manufactured in Mercury’s Advanced Microelectronics Center (AMC), a secure Defense Microelectronics Activity (DMEA) trusted facility in Phoenix, Ariz.

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