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January 2012 RF Chip Inductors Stay Ahead Of EMI RF chip inductors are critical to many tuning and filtering circuits. — January 2012 Overcome LTE-A Carrier-Aggregation Issues The emerging wireless communications standard, Long Term Evolution-Advanced (LTE-A), is specified as part of Release 10 of the Third-Generation Partnership Project specifications. — December 2011 Integrated Solutions Conquer MIMO Testing Because they inhabit such high-multipath environments, commercial wireless systems greatly benefit from the use of multiple-input multiple-output (MIMO) antenna systems. — December 2011 Small-Cell Architectures Support Data Traffic Much has been said about the need for small-cell architectures to support the rollout of next-generation telecommunications networks. — December 2011 Top Application Trends of 2011 Novel applications continue to push technology forward. — Nancy Friedrich December 2011 Get A Feel For Energy Harvesting's Current Strongholds Last month, IDTechEx held the Energy Harvesting & Storage USA event in Boston, MA. — Nancy Friedrich November 2011 Design And Test Merge Since the spring, the industry has been waiting to see results of National Instruments’ (www.ni.com) acquisition of AWR Corp. (www.awrcorp.com). — November 2011 Ease The Transition From WiMAX To LTE The adoption of Long Term Evolution (LTE) technology quickly eclipsed WiMAX’s potential market hold. — October 2011 Antenna-Based Approach Is Best For Self-Organizing Networks For next-generation cellular networks, operators are hoping to limit their financial payout by relying on self-organizing networks (SONs). — October 2011 Get A Handle On Oscillator Phase Noise As electronic applications proliferate and their frequencies rise, designers are increasingly calling for time bases that are more stable with lower noise. — September 2011 Spectrum Reassignment Bodes Well For Economy In this lagging recession, much hope has been pinned on future broadband communications jobs—and for good reason. Between 2002 and 2010, capital spending in the wireless industry is said to have exceeded $185 billion. On average, it created about 420,000 jobs throughout the economy (based on CTIA investment figures and the BEA 2010 employment multiplier). In a new study by Mobile Future and David Sosa and Marc Van Audenrode from Analysis Group, Inc., financial... — September 2011 LDMOS Expands Its Niche To ISM And Beyond In the semiconductor industry, each process technology is known for its own strengths and weaknesses. As a result, every technology targets different applications and often develops niches. RF laterally diffused metal oxide semiconductor (LDMOS), for example, is currently the dominant device technology used in high-power RF transistors and power-amplifier (PA) applications from 1 MHz to beyond 3.5 GHz. In a 12-page white paper, Freescale... — August 2011 Choose The Right Cable Assembly Although today’s cable assemblies are smaller and lighter, the market demands that they last longer and cost less. Yet they are being used in more challenging RF and microwave environments, where they are exposed to extreme temperatures, chemicals, abrasion, and flexing. Noting that these requirements are basically at odds with each other, W.L. Gore’s Lead Design Engineer, Paul Pino, has created a white paper titled, “Impact of Materials on Microwave Cable... — August 2011 Master Key Field Measurements For DVB-T/H And ISBD-T Handheld field-test instruments have become critical to today’s communications and broadcasting networks, performing tasks ranging from performance verification to problem solving. For example, an application note from Anritsu Co. focuses on the single-frequency networks (SFNs) pertaining to digital terrestrial broadcasting. It details the measurements that should be performed during installation, commission, and maintenance. Titled “Understanding Single Frequency... — July 2011 Simple Balun Solution Serves Low-Power Communications Transceiver Today’s designs call for increased miniaturization and integration. They also must be robust so that they achieve good yields while providing the lowest possible bill-of-material (BOM) cost. In addition to the number and types of parts and their associated costs, the price depends on the size of the printed-circuit board (PCB) and the enclosure. In an application note titled “Anaren 0404 (BD2425N100ATI) Balun Optimized for Texas Instruments CC2530 Transceiver,” Anaren... — July 2011 Get A Feel For Today’s Semiconductor Ecosystem In recent years, collaborative innovation has become more common between semiconductor companies and their partners. Unfortunately, such efforts are often hampered by both the technological and organizational challenges brought about by increasing complexity, competition, and change. As part of a two-year research effort, the 2010 Wharton-Global Semiconductor Alliance (GSA) Semiconductor Ecosystem Survey has attempted to systematically analyze the challenges ... — July 2011 Microwaves Energize Medical Applications Bringing new medical products to market has always posed challenges, owing to requirements for FDA approval in the US and similar regulatory demands in many other countries. — Nancy Friedrich June 2011 Speed Measurements For Antenna And RCS Applications To make antenna and radar-cross-section (RCS) testing more productive, engineers need faster test speeds, new measurement capabilities, and enhanced features. If such capabilities are attained, the benefits will range from less strain on resources to faster time to market. In a 28-page application note titled, “Reducing Measurement Times and Improving Economic Competitiveness in Antenna and RCS Applications,” Agilent Technologies details test-range configurations... — June 2011 Applications Determine Switch-Matrix Designs Next-generation communications systems like Long Term Evolution Advanced (LTE-A) are feeding the need for RF/Microwave Switch Matrices for reliable automatic-test-equipment (ATE) instrumentation. Such matrices must cover DC to 6 GHz while providing fast responses and repeatable performance. Aside from routing high-frequency signals, they also may contain signal-conditioning components. Yet most important among all these features is that the switch be configured... — May 2011 MMIC Thermal Simulation Is Part Of Design Flow For designers of monolithic microwave integrated circuits (MMICs), thermal simulation has generally been done using an esoteric piece of mechanical-engineering software. Such simulation can now be part of an integrated RF/ microwave design flow, however—thanks to SYMMIC’s template-based approach, simulation speed, and scripted integration to AWR’s Microwave Office. This capability is the focus of a six-page application note from AWR titled, “AWR Connected for CapeSym... —  prev. page
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