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March Microwave Materials Help Build An Industry Materials suppliers are constantly refining their recipes in search of products that offer greater value and increased reliability for a variety of commercial, industrial, and military applications Jack Browne Technical Director Microwave materials represent building blocks for high-frequency circuits and systems. Whether they are used to hold circuit traces, absorb or suppress radiofrequency interference (RFI), or form resonant... — Jack Browne March Metamaterials Show Potential For Planar Components Metamaterials intrigue researchers for their potential to fabricate tunable and wideband passive components. Because of line parasitics, the reactive elements responsible for the left-handed (LH) band exhibit a forward or right-handed (RH) transmission band at higher frequencies. Usually, they are separated from the LH band by a stop band. Due to the composite behavior of LC loaded lines, these structures were called composite right/left-handed (CRLH) transmission lines.... — Nancy Friedrich February 21, 2008 Fine Tuning Those Microwave Materials — Jack Browne February Gore Celebrates 50 Years Of PTFE Most RF/microwave engineers know it by the acronym PTFE rather than the full name of polytetrafluoroethylene. The polymer is ever-present in the high-frequency industry in coaxial and fiber-optic cables, printed-circuitboard (PCB) materials, and electromagnetic-interference (EMI) shielding materials and gaskets. It is also the basis for innovative products in other industries, ranging from energy to medicine. The company behind the many applications for PTFE is W. L.... — Jack Browne August 2007 Predict Resonances Of Shielded PCBs Shielded enclosures are commonly used as protection for microwave printed-circuit boards (PCBs). While the enclosure can guard a PCB from environmental effects, it can also alter the electrical performance of the circuit. Understanding the effects of the enclosure and how to predict them can improve the accuracy of most modern computeraided-engineering (CAE) simulation tools. As Part 1 of this two-part article series explored last month, the effects of the shielded... — Avinash Sharma August 2007 BeO Takes The Heat In RF Transistor Packages Power-transistor packaging is not immune to the cost pressures facing commercial RF and microwave markets. RF power-transistor suppliers have long sought alternative materials to traditional insulating materials such as ceramics, including BeO. But the superior characteristics of BeO continue to make it the material of choice at the highest power levels at frequencies up to 4 GHz, especially in demanding military and aerospace pulsed power applications. BeO... — John E. Scheatzle August 10, 2007 August 9, 2007 Newsletter — Jack Browne August 9, 2007 PCB Industry To Flourish — Jack Browne April 26, 2007 Remtec Develops Etchable Materials Capability — Jack Browne April 2007 Developing Designs For RFID Transponder Using DTMOS Transponder design for radio-frequency-identification (RFID) circuits must overcome many of the challenges faced by other low-power electronic applications. RFID transponder circuitry must be low in cost, and must operate over long periods of time on limited power sources. Earlier in the article series (Microwaves & RF, September 2006, p. 57 and October 2006, p. 82), basic design strategies were presented for designing RFID transponder integrated circuits (ICs) and... — A. Kordesch , et al. March 2007 PCTF Approach Saves MW/RF Component/Module Costs Packaging is a critical part of RF/microwave component and module design. The package provides protection but, at higher frequencies, is also part of the circuitry. For that reason, the package must provide excellent electrical performance, environmental protection, shielding, and a host of other characteristics in support of a module or component. Ceramic materials are often the primary choice for these critical packaging applications. Ceramics feature stable... — Nahum Rapoport December 2004 Novel Contacts Aid Lead-Free Packaging Electronics manufacturing is steadily moving toward the use of lead-free packaging and lead-free printed-circuit-board (PCB) attachments. The European Union (EU) has already established Directive 2002/95/EC on the restriction of certain hazardous... — Jack Browne August 2004 Liquid-Crystalline Polymers Bond Multilayer Circuits Flexible circuits have long been associated with polyimide films, although such materials have been limited in high-frequency performance. The R/flex® 3000 line of liquid-crystal-polymer (LCP) circuit materials from Rogers Corp.... — Jack Browne April 7, 2004 Infineon Cools Down LDMOS Transistors — Jack Browne November 2003 Novel Materials Form Tunable Components Tuning a high-frequency circuit usually involves trimming a variable capacitor or turning a mechanical tuner. By using innovative circuit materials formed of barium-strontium-titanate (BST) dielectric, however, Agile Materials & Technologies... — Jack Browne October 24, 2003 Miniature Microwave Furnace Aids Materials Research — Jack Browne October 24, 2003 HTS Technology Advanced For Government/Military Applications — Jack Browne October 2003 Engineered Substrates Yield High Stability Temperature stability is a key to the successful integration of numerous components, including filters and resonators, in wireless and other designs. For example, surface-acoustic-wave (SAW) devices offer superb selectivity, although with performance... — Jack Browne August 2003 Mounting Technique Aids MMIC Performance Performance levels of high-frequency monolithic-microwave integrated circuits (MMICs) are often compromised within packages and circuits. Fortunately, a novel technique for mounting MMICs in microstrip circuits helps optimize device performance even... — Larry Silverman May 2003 Improve PCB Shielding For Portable Devices Miniaturization of handsets and other wireless devices creates scores of shielding challenges as high-frequency components become more closely spaced. As printed-circuit boards (PCBs) shrink, new electromagnetic-interference (EMI) shielding... — Thomas Clupper  prev. page
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