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May 11, 2010 [Devices & ICs] Sizing Up Benefits Of Wafer-Scale Packaging Wafer-scale packaging (WSP) is a bold new approach to housing semiconductors. It uses a semiconductor process to create a package around an IC—a package that is only slightly larger than the chip itself. To learn more about WSP technology, don’t miss this FAQ, sponsored by Avago Technologies — Staff April 16, 2010 [Communications] Avago RF VMMK Devices Improve Performance by Reducing Parasitic Inductance and Capacitance Packaging has always significantly impacted on microwave IC and amplifier performance. In most cases, the inherent parasitic capacitance and inductance of the package lead frame and wire bonds set a limit to circuit performance. Avago Technologies developed a bonded-wafer-to-wafer package technology in 2004 and now offers innovative microwave gallium arsenide (GaAs) VMMK devices based on the proprietary WaferCAP™ chip scale package. — Staff March 1, 2010 [Communications] White Paper: Fiber Optic Transceivers in Basestation Applications Base station transceivers with greater bandwidth are in demand. Fiber optic links give cost effective, high bandwidth new capacity with more flexibility than copper links. Fiber links make system modifications and future upgrades simpler than would be possible with traditional copper links. In addition, fiber features inherent data security and superior reliability in hostile environments. — Staff March 1, 2010 [Communications] White Paper: Integration Creates Compact CDMA RF Front End with GPS Capability In this whitepaper, design requirements, best practice PCB layout, component selection and system design will be addressed. — Staff March 1, 2010 [Communications] White Paper: GaAs-Based Surface Mount Wafer Scale Package MMICs for DC to 45 GHz Applications Packaging has always been the "Achilles Heal" of extracting the maximum microwave performance out of any IC technology. The inherent parasitic capacitance and inductance associated with bond wires, lead frames, and encapsulating dielectric materials dominate the final products high frequency performance. — Staff January 27, 2010 [Research & Development] Integration Creates Compact CDMA RF Front End with GPS Capability In this whitepaper, design requirements, best practice PCB layout, component selection and system design will be addressed. — Staff January 27, 2010 [Research & Development] Fiber Optic Transceivers in Basestation Applications Base station transceivers with greater bandwidth are in demand. Fiber optic links give cost effective, high bandwidth new capacity with more flexibility than copper links. Fiber links make system modifications and future upgrades simpler than would be possible with traditional copper links. In addition, fiber features inherent data security and superior reliability in hostile environments. — Staff January 27, 2010 [Research & Development] GaAs-Based Surface Mount Wafer Scale Package MMICs for DC to 45 GHz Applications Packaging has always been the "Achilles Heal" of extracting the maximum microwave performance out of any IC technology. — Staff September 15, 2009 [Test & Measurement] Understanding Long-Term Evolution Fundamentals and Measurement Challenges This comprehensive white paper is a must-read for anyone who needs to know both basic information about the Long Term Evolution (LTE) enhancement to UMTS, as well as the test and measurement challenges posed by this complex standard. — Staff June 24, 2009 [Test & Measurement] Whitepaper: Seven ways a Test Engineering Platform will help you cut costs and increase your competitive edge This white paper explores seven ways that a centralized test platform will transform your test process, provide easier access to metrics and KPIs, and give greater control over remote manufacturing, helping you trim costs and stay competitive. — Staff June 24, 2009 [Test & Measurement] Whitepaper: Providing Manufacturing-Ready Capabilities to NI TestStand This application example shows how to bridge a powerful NI TestStand infrastructure with an off-the-shelf test engineering platform to gain component and product traceability, genealogy and data storage, process flow and routing, multi-station / multi-line management, and web-based reporting. — Staff June 24, 2009 [Test & Measurement] Whitepaper: FM Receiver - Extreme Dynamic Range Test Case One of the most challenging test conditions for RF receiver validation is the adjacent and/or alternate channel test case with a large difference in level between the main signal and the alternate, interfering channel. — Staff June 24, 2009 [Conferences] NXP's LDMOS transistors and amplifiers NXP Semiconductors details its latest LDMOS developments in transistors and amplifiers. — Staff June 24, 2009 [Conferences] NXP's RF-BiCMOS process technology NXP Semiconductor provides insight into its QUBiC4 RF-BiCMOS process technology. — Staff September 2007 [Test & Measurement] Making Source-Corrected Noise-Figure Measurements Noise limits the sensitivity of a receiver and degrades the performance of a transmitter.Both R&D and production environments rely on several time-honored approaches to evaluate component noise in terms of noise figure. They now have an additional option in the form of single-connection, source-corrected noise-figure measurements through 26.5 GHz using the Agilent PNA-X vector network analyzer (VNA) from Agilent Technologies (... — David Ballo August 2007 [Commercial] Perfecting Pulsed RF Radar Measurements Pulsed RF radar signals must be accurately characterized to evaluate a radar system's performance,therefore using the right test tools is vital. Modern radar test instruments,with advances in DSP measurement technology, are able to provide even greater insight than their analog counterparts.The increased performance, flexibility, and functionality of modern instruments are especially useful when evaluating radars that use advanced pulse compression techniques and pulse... — John Barfuss August 9, 2007 [Test & Measurement] Perfecting Pulsed RF Radar Measurements — John Barfuss May 2007 [Devices & ICs] The RF Power Behind Design Innovation Power density in active devices is increasing according to the demands of transistor users. Applications in commercial wireless, avionics, broadcast, industrial, and medical systems are pushing the envelope for solid-state power, with growing requirements for higher output power levels from fewer output-stage devices. At Freescale Semiconductor, supplying high-performance radio frequency (RF) and microwave transistors for these applications is only part of the... — Peter Aaen , et al. November 2006 [Test & Measurement] Measure And Troubleshoot Digitally Modulated Signals The Agilent MXA signal analyzer (Fig. 1) combines the capabilities of a traditional swept-tuned spectrum analyzer and a vector signal analyzer. The midrange family of signal analyzers currently offers four versions spanning 20 Hz to 3.6 GHz, 8.4 GHz, 13.6 GHz, and 26.5 GHz. Its fast tuning speed and standards-based measurement applications might land it on the production line, but it is also a powerful research and design... — Ben Zarlingo October 2006 [Test & Measurement] Improve The Accuracy Of Amplifier ACLR And ACPR Measurements The Agilent MXG vector signal generator (Fig. 1) produces the type of complex modulated signals found in modern digital wireless-communications systems, but without adding distortion of its own. The instrument is intuitive to use, allowing operators to modify key signal parameters "on the fly" locally or remotely. Ideally, the power amplifier in a wireless base transceiver station (BTS) would boost output... — Paul Schmitz  prev. page
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