Staff
 Write for Microwaves & RF
43 results found for Staff, displaying items 1 - 20

May 21, 2010   [Conferences]
International Microwave Symposium 2010
The IEEE’s 2010 International Microwave Symposium (IMS) is sure to be packed with people, new products, and cutting-edge technology. Microwaves & RF is covering the show from all angles, to give design engineers a roadmap for the week’s most important announcements. Check out all the news from the show here!

May 11, 2010   [Devices & ICs]
Sizing Up Benefits Of Wafer-Scale Packaging
Wafer-scale packaging (WSP) is a bold new approach to housing semiconductors. It uses a semiconductor process to create a package around an IC—a package that is only slightly larger than the chip itself. To learn more about WSP technology, don’t miss this FAQ, sponsored by Avago Technologies

April 16, 2010   [Communications]
Avago RF VMMK Devices Improve Performance by Reducing Parasitic Inductance and Capacitance
Packaging has always significantly impacted on microwave IC and amplifier performance. In most cases, the inherent parasitic capacitance and inductance of the package lead frame and wire bonds set a limit to circuit performance. Avago Technologies developed a bonded-wafer-to-wafer package technology in 2004 and now offers innovative microwave gallium arsenide (GaAs) VMMK devices based on the proprietary WaferCAP™ chip scale package.

March 17, 2010   [Conferences]
Rohde & Schwarz R & S CMW500 Wideband Communications Tester at Mobile World Congress 2010
Paul Whytock talks with Christian Dobmeier, Product Manager of Mobile Radio Protocol Testers with Rohde & Schwarz about the company’s R & S CMW500 Wideband Communications Tester.

March 17, 2010   [Conferences]
Xilinx- LTE Baseband Targeted Design Platform-Mobile World Congress 2010
Mark Quartermain, Baseband Product Marketing Manager with Xilinx. explains the LTE Baseband Targeted Design Platform

March 17, 2010   [Conferences]
Lime Microsystems- LMS6002D Wide band Multi-Standard Transceiver-Mobile World Congress 2010
Paul Whytock talks with Dr Ebrahim Busheri, CEO of Lime Microsystems about the LMS6002D Wide band Multi-Standard Transceiver

March 17, 2010   [Conferences]
Global Foundries Semiconductor Development
VP of Marketing with Global Foundries explains his company’s semiconductor development work in conjunction with ARM

March 17, 2010   [Conferences]
NetHawk and Aeroflex describe the East 500 Capacity tester for LTE-Mobile World Congress 2010
Petri Yllasjarvi, Global Key Account Manager for NetHawk and Nick Carter, Product Manager, System Test Products with Aeroflex describe the company's East 500 Capacity tester for LTE

March 17, 2010   [Conferences]
Xilinx-Radio Targeted Design Platform
Senior Product Manager with Xilinx, David Hawke describes the company’s Radio Targeted Design Platform to Paul Whytock

March 17, 2010   [Conferences]
picoChip-PC323 Next Generation Femtocell Chip at Mobile World Congress 2010
Paul Whytock talks with Rupert Baines, VP of Marketing with picoChip about the PC323 next generation femtocell chip

March 1, 2010   [Communications]
White Paper: Fiber Optic Transceivers in Basestation Applications
Base station transceivers with greater bandwidth are in demand. Fiber optic links give cost effective, high bandwidth new capacity with more flexibility than copper links. Fiber links make system modifications and future upgrades simpler than would be possible with traditional copper links. In addition, fiber features inherent data security and superior reliability in hostile environments.

March 1, 2010   [Communications]
White Paper: Integration Creates Compact CDMA RF Front End with GPS Capability
In this whitepaper, design requirements, best practice PCB layout, component selection and system design will be addressed.

March 1, 2010   [Communications]
White Paper: GaAs-Based Surface Mount Wafer Scale Package MMICs for DC to 45 GHz Applications
Packaging has always been the "Achilles Heal" of extracting the maximum microwave performance out of any IC technology. The inherent parasitic capacitance and inductance associated with bond wires, lead frames, and encapsulating dielectric materials dominate the final products high frequency performance.

February 16, 2010   [Conferences]
Mobile World Congress 2010
Staged in the Spanish city of Barcelona the 2010 Mobile World Congress provides an international forum for over 1300 companies to present the products and technology that will shape the future of mobile communications. In addition to it’s huge exhibition content the Mobile World Congress also serves as a global hub where industry experts can discuss the industry trends that drive wireless communications forward.

January 27, 2010   [Research & Development]
Integration Creates Compact CDMA RF Front End with GPS Capability
In this whitepaper, design requirements, best practice PCB layout, component selection and system design will be addressed.

January 27, 2010   [Research & Development]
Fiber Optic Transceivers in Basestation Applications
Base station transceivers with greater bandwidth are in demand. Fiber optic links give cost effective, high bandwidth new capacity with more flexibility than copper links. Fiber links make system modifications and future upgrades simpler than would be possible with traditional copper links. In addition, fiber features inherent data security and superior reliability in hostile environments.

January 27, 2010   [Research & Development]
GaAs-Based Surface Mount Wafer Scale Package MMICs for DC to 45 GHz Applications
Packaging has always been the "Achilles Heal" of extracting the maximum microwave performance out of any IC technology.

November 25, 2009   [Industry News]
Video Interviews
Video interviews on MWRF

November 23, 2009   [Industry News]
The State of Giga-tronics Today
Giga-tronics has changed much over its 30-year history. As the company prepared to ring the NASDAQ bell, we talked to its CEO, John Regazzi, and CFO, Pat Lawlor, about the current state of the industry and how the company is adapting.

October 20, 2009   [Conferences]
Frequency Extension Analyzer
Frequency Extension Analyzer for RSA6100A up to 20GHz and the newly announced Tektronix partnership with Mesuro.





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