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May 2007 [Computer-Aided Engineering] Achieve First-Pass LTCC Design Success With DFM Low-temperature-cofired-ceramic (LTCC) circuit technology supports compact, multilayer designs and is now widely used in wireless applications, especially in RF modules and system-in-package (SiP) designs. It has a number of advantages over laminate technologies, although the process is similar to those used for laminated printed-circuit-board (PCB) materials. Typical advantages are lower dielectric loss, higher packaging density, and integrated/embedded passive... |
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