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March 2007 [Materials] PCTF Approach Saves MW/RF Component/Module Costs Packaging is a critical part of RF/microwave component and module design. The package provides protection but, at higher frequencies, is also part of the circuitry. For that reason, the package must provide excellent electrical performance, environmental protection, shielding, and a host of other characteristics in support of a module or component. Ceramic materials are often the primary choice for these critical packaging applications. Ceramics feature stable... |
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