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July 2006 [Commercial] Connectors Raise Density And Reduce Footprint A major defense contractor wanted to eliminate the use of cable assemblies for its in-the-box applications. The contractor gave W.L. Gore & Associates the challenge of developing low-profile boardto-board interconnects for its Common Radar Module (CRM) architecture. The requirements for a super-density, push-on interconnect series included the following: center-to-center spacing of 0.085 in. maximum, printed-circuit-board (PCB) -to-PCB stack height of 0.110 in. maximum, lowest possible... |
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